{
 "about": "VC、研究机构和公司画的 AI 硬件市场图谱，每张打开原文核对过；g = 对应 layers.json 的 code，all = 全景。",
 "maps": [
  {
   "by": "陀螺研究院（VR陀螺）",
   "t": "陀螺研究院发布《2026年AI+AR眼镜产业图谱》",
   "d": "2026-01",
   "u": "https://vrtuoluo.net/column/nianzhong/544477.html",
   "img": "https://res.vrtuoluo.cn/production/admin/uploads/20260112/1768209864604%E3%80%900112%E3%80%91AI%2BAR%E7%9C%BC%E9%95%9C%E4%BA%A7%E4%B8%9A%E5%9B%BE%E8%B0%B1+2026%E5%B9%B4%E7%89%88.png",
   "type": "research",
   "topic": "眼镜与XR",
   "g": [
    "g1",
    "g2",
    "g3",
    "x1"
   ],
   "cats": "分供应链（芯片、Micro-LED/LCoS、光波导、传感器、电池、交互、大模型、ODM/OEM）、终端品牌（AI+AR 眼镜、AI 音频/拍摄眼镜、音频眼镜）和传统眼镜品牌三大块，logo 墙形式，约数百家。",
   "note": "目前能找到的最全的 AI 眼镜产业链图，终端品牌三栏刚好对应我们 g1/g2；供应链一栏可给 x1 层补芯片厂商。"
  },
  {
   "by": "陀螺研究院（VR陀螺）",
   "t": "陀螺研究院发布《2026年全球虚拟（增强）现实产业图谱》",
   "d": "2026-01",
   "u": "https://vrtuoluo.net/column/nianzhong/544487.html",
   "img": "https://res.vrtuoluo.cn/production/admin/uploads/20260112/1768209964045%E7%BB%88%E7%AB%AF%E7%A1%AC%E4%BB%B6%26%E9%85%8D%E5%A5%97%E5%A4%96%E8%AE%BE.png",
   "type": "research",
   "topic": "眼镜与XR",
   "g": [
    "g1",
    "g2",
    "g3"
   ],
   "cats": "按核心器件与感知交互、终端硬件与配套外设、软件、内容、应用、服务七张子图分层；图片为其中「终端硬件」一张：AI 音频/拍照眼镜、AR 一体机/分体机、VR 一体/分体机、ODM-OEM 和外设。",
   "note": "终端硬件图一次把眼镜、AR、VR 厂商列全，对应我们 g1/g2/g3；其余六张子图在原文页内。"
  },
  {
   "by": "陀螺研究院（VR陀螺）",
   "t": "AI眼镜大战升级，40家核心芯片厂商一览｜2026年最新产业图谱",
   "d": "2026-05",
   "u": "https://www.vrtuoluo.cn/545267.html",
   "img": "https://res.vrtuoluo.cn/production/admin/uploads/20260525/1779672921839-pasted_image_1779672921468.jpg",
   "type": "research",
   "topic": "芯片与供应链",
   "g": [
    "x1"
   ],
   "cats": "AI 眼镜供应链芯片板块 40 家，分 SoC、MCU、协处理（ISP 等）、存储芯片，每家带成立时间、融资阶段和简介的表格。",
   "note": "表格式而非 logo 墙，但信息密：高通、联发科、恒玄、瑞芯微、全志、紫光展锐等，可直接对照 x1 层的眼镜芯片卡。"
  },
  {
   "by": "中商产业研究院（中商情报网）",
   "t": "2025年中国AI眼镜产业链图谱及投资布局分析（附产业链全景图）",
   "d": "2025-11",
   "u": "https://www.askci.com/news/chanye/20251126/085040276411823961563551.shtml",
   "img": "http://image1.askci.com/images/2025/11/25/3b3a9b4ba4d94a4ab1ae6f4b1d6e8b49_57.png",
   "type": "research",
   "topic": "眼镜与XR",
   "g": [
    "g1",
    "g2"
   ],
   "cats": "上游零部件（主控芯片、传感器、存储、显示、光学、结构件）、中游整机与代工、下游应用三段式产业链，列代表企业。",
   "note": "上中下游框图型，企业数量不多，适合做产业链结构参考；品牌层信息不如陀螺全。"
  },
  {
   "by": "中商产业研究院（中商情报网）",
   "t": "2026年中国智能眼镜产业链图谱及投资布局分析（附产业链全景图）",
   "d": "2026-03",
   "u": "https://www.seccw.com/Document/detail/id/42909.html",
   "img": "http://image1.askci.com/images/2026/03/30/2c36f3de7e114eb397ea538dcfb69b60_66.png",
   "type": "research",
   "topic": "眼镜与XR",
   "g": [
    "g1",
    "g2",
    "g3"
   ],
   "cats": "智能眼镜产业链全景：上游核心零部件、中游整机品牌与代工、下游渠道与应用，附投资布局。",
   "note": "2025-11 那版的更新，品牌栏补入华为、小米、阿里、雷鸟、Rokid 等；转载页为深圳市电子商会，原发中商情报网。"
  },
  {
   "by": "Synaptic",
   "t": "Chipping Away: AI x Hardware",
   "d": "2025-03",
   "u": "https://synaptic.com/resources/chipping-away-ai-hardware/",
   "img": "https://framerusercontent.com/images/Fbn0or1K9xP2QUX65aGtaiwJf8.png",
   "type": "vc",
   "topic": "芯片与供应链",
   "g": [
    "x1",
    "g3",
    "w1"
   ],
   "cats": "AI Infrastructure（芯片、服务器、Edge AI Processors）和 AI-enabled Hardware（Consumer、Mobility、Healthcare、Industrial、Defense）两大块的市场图，另附融资图。",
   "note": "Consumer 一行收了 rabbit、XREAL、RayNeo、Solos 等，Edge AI 一行有 Hailo、Mythic、MemryX，可对 x1 与 g3 层；文中也提到 HP 收购 Humane。"
  },
  {
   "by": "Woodside Capital Partners",
   "who": "Alain Bismuth, Rudy Burger, Alex Bonilla",
   "t": "XR Tech Market Report (June 2025)",
   "d": "2025-06",
   "u": "https://www.edge-ai-vision.com/2025/08/xr-tech-market-report/",
   "type": "vc",
   "topic": "眼镜与XR",
   "g": [
    "g3",
    "g1"
   ],
   "cats": "XR 生态研究报告，含生态图、关键结论、融资与并购分析；与 VR/AR Association、Yole 联合。",
   "note": "精品投行视角，讲 AR 眼镜赛道的资本投入；页面只有封面图，生态图在 PDF 内，未收图片地址。"
  },
  {
   "by": "Woodside Capital Partners",
   "t": "Smart Glasses for the Consumer Market",
   "d": "2024-10",
   "u": "https://woodsidecap.com/smart-glasses-for-the-consumer-market/",
   "type": "vc",
   "topic": "眼镜与XR",
   "g": [
    "g1",
    "g2",
    "g3"
   ],
   "cats": "头戴可穿戴约 250 家公司、累计融资超 50 亿美元，分 AR/XR 头显与带摄像头无显示的智能眼镜两类。",
   "note": "最早把「有显示 / 无显示」分开讲的投行报告，和我们 g1/g2 的分法一致；无公开图。"
  },
  {
   "by": "Jon Peddie Research",
   "t": "Jon Peddie Research: Mapping the $387B AI processor landscape",
   "d": "2025-10",
   "u": "https://www.jonpeddie.com/news/jon-peddie-research-mapping-the-387b-ai-processor-landscape/",
   "type": "research",
   "topic": "芯片与供应链",
   "g": [
    "x1"
   ],
   "cats": "2025 年 AI 处理器报告，自称 357 页的 market map，收 137 家做专用 AI 芯片/IP 的公司，覆盖 18 国，含云端到端侧（可穿戴到 PC）。",
   "note": "端侧芯片公司的全名单，适合给 x1 层找候选；图在付费报告内，页面仅封面。"
  },
  {
   "by": "Jon Peddie Research",
   "t": "JPR releases report on AI-based wearables",
   "d": "2026-05",
   "u": "https://www.jonpeddie.com/news/jpr-releases-report-on-ai-based-wearables/",
   "type": "research",
   "topic": "芯片与供应链",
   "g": [
    "x1",
    "g1",
    "g2",
    "n1",
    "w1"
   ],
   "cats": "AI Processors in Wearables 报告，按智能眼镜、智能戒指、XR 头显、助听器、手环等形态梳理 SoC 厂商与方案。",
   "note": "专门讲可穿戴里的 AI 芯片，对应 x1 与各穿戴层；付费报告，无图。"
  },
  {
   "by": "智次方研究院 × 广东智用人工智能应用研究院",
   "t": "《中国端侧 AI 全景图谱报告》已正式发布",
   "d": "2025-07",
   "u": "https://www.iot101.com/mobile/news/9935.html",
   "type": "research",
   "topic": "芯片与供应链",
   "g": [
    "x1",
    "all"
   ],
   "cats": "国内首个端侧 AI 产业生态全景报告，梳理产业链上下游（芯片、模组、终端、应用）细分环节。",
   "note": "中国端侧 AI 全景，发布于 2025 数智融合领袖峰会；页面图片地址失效，未收图。"
  },
  {
   "by": "集微咨询（JW Insights）",
   "t": "集微咨询发布《2026年端侧AI芯片行业研究报告》",
   "d": "2026-09",
   "u": "https://www.laoyaoba.com/html/share/news/1100188",
   "type": "research",
   "topic": "芯片与供应链",
   "g": [
    "x1"
   ],
   "cats": "报告含产业概述、市场概况、竞争格局、产业链分析及产业图谱五个维度，覆盖手机、PC、可穿戴、汽车、机器人端侧芯片。",
   "note": "中国视角的端侧 AI 芯片产业图谱；页面只有新闻稿，无图谱图片。"
  }
 ]
}